News release

HP Awarded Infrastructure Services Contract with Sara Lee

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HP today announced it has been awarded a seven-year infrastructure services contract from Sara Lee Corporation to manage its global technology environment.

The deal is part of Sara Lee’s global transformation to increase operational efficiencies and reduce costs across its businesses around the world.

HP will extend its current agreement to 2015 and add the management of Sara Lee’s North America infrastructure technology to make this a fully global contract. HP also will transition Sara Lee’s infrastructure technology to HP’s next-generation data center in Atlanta. This automated environment will provide the latest infrastructure management and automation delivered as a service for Sara Lee.

The agreement builds on a long-standing relationship between Sara Lee and HP. Since 2000, HP has provided services to support Sara Lee’s technology infrastructure in Europe, the Middle East, Africa, Latin America and Asia, as well as Sara Lee’s end-user environment across the globe.

“This new agreement with HP helps Sara Lee to increase efficiencies and further supports our goal of operational excellence,” said Steve Merry, senior vice president and chief information officer, Sara Lee Corporation. “Over the past eight years, HP has consistently been a trusted partner that understands how technology can help us achieve our business objectives.”

“Since 2000, Sara Lee has been able to lower costs, reduce risk and accelerate growth with HP managing and transforming its technology environment,” said Ann Livermore, executive vice president, Technology Solutions Group, HP. “This latest agreement with Sara Lee provides the right infrastructure to meet its customers’ needs today and into the future.”

About Sara Lee Corporation

Each and every day, Sara Lee (NYSE: SLE) delights millions of consumers and customers around the world. The company has one of the world’s best-loved and leading portfolios with its innovative and trusted food, beverage, household and body care brands, including Ambi Pur, Ball Park, Douwe Egberts, Hillshire Farm, Jimmy Dean, Kiwi, Sanex, Sara Lee and Senseo. Collectively, these brands generate more than $12 billion in annual net sales covering approximately 200 countries. The Sara Lee community consists of 52,000 employees worldwide. Please visit www.saralee.com for the latest news and in-depth information about Sara Lee and its brands.

About HP

HP, the world’s largest technology company, provides printing and personal computing products and IT services, software and solutions that simplify the technology experience for consumers and businesses. HP completed its acquisition of EDS on Aug. 26, 2008. More information about HP (NYSE: HPQ) is available at http://www.hp.com.

This news release contains forward-looking statements that involve risks, uncertainties and assumptions. If such risks or uncertainties materialize or such assumptions prove incorrect, the results of HP and its consolidated subsidiaries could differ materially from those expressed or implied by such forward-looking statements and assumptions. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations; any statements concerning expected development, performance or market share relating to products and services; anticipated operational and financial results; any statements of expectation or belief; and any statements of assumptions underlying any of the foregoing. Risks, uncertainties and assumptions include the execution and performance of contracts by HP and its customers, suppliers and partners; the achievement of expected results; and other risks that are described in HP’s Quarterly Report on Form 10-Q for the fiscal quarter ended July 31, 2008 and HP’s other filings with the Securities and Exchange Commission, including but not limited to HP’s Annual Report on Form 10-K for the fiscal year ended October 31, 2007. HP assumes no obligation and does not intend to update these forward-looking statements.

© 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. HP shall not be liable for technical or editorial errors or omissions contained herein.